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CM1225
PACKAGE DIMENSIONS
UDFN10 2.5x1, 0.5P
CASE 517BB ? 01
ISSUE O
2X
PIN ONE
REFERENCE
0.10 C
D
A B
E
L1
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
MILLIMETERS
DIM
A
MIN
0.45
MAX
0.55
2X
0.10 C
TOP VIEW
EXPOSED Cu
MOLD CMPD
A1
A3
0.00 0.05
0.13 REF
b
0.15
0.25
0.10 C
DETAIL B
A3
A
A3
b2
D
E
e
0.35 0.45
2.50 BSC
1.00 BSC
0.50 BSC
10X
0.08 C
SIDE VIEW
A1
C
SEATING
PLANE
A1
DETAIL B
OPTIONAL
CONSTRUCTION
L
L1
0.30
---
0.40
0.05
2X
DETAIL A
b2
1
10
5
6
10X
L
RECOMMENDED
SOLDERING FOOTPRINT*
e
8X
b
10X
0.50
2X
0.45
0.10 C A
B
BOTTOM VIEW
0.05 C
NOTE 3
1.30
PACKAGE
OUTLINE
0.50
PITCH
8X 0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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CM1225/D
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